Samsung can master 3-nanometer process technology faster than TSMC

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According to the well-known Taiwanese publication DigiTimes, Samsung can overtake TSMC in the “nanometer” race: after mastering the norms of the 5-nanometer process technology, Samsung will immediately switch to the 3-nanometer race, bypassing the 4-nm step. This will give her an advantage in the long run, but in the near future may result in an outflow of customers.

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unexpectedly surpassed Samsung and became the market leader in smartphones. True, only in April

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Huawei is increasingly feeling the pressure of US sanctions. We have already seen a significant decrease in sales in a number of markets due to the lack of Google services on modern Huawei and Honor smartphones. In addition, it is not yet clear how the company will get out of the gap situation with the TSMC.

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Huawei’s salvation may be its “worst enemy” – Samsung. Korean giant could start producing products for its competitor

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As you know, Huawei will soon lose the ability to place orders at the TSMC facilities for the production of its single-chip systems. And not only for smartphones, but also for 5G base stations, which is even worse for Huawei, since the company can replace SoC Kirin in smartphones, but it is much more difficult to do this in base stations.

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TSMC is confident that they will quickly fill the gap in orders if they can’t work with Huawei

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Taiwan Semiconductor Manufacturing Co (TSMC), the largest contracted semiconductor manufacturer, is able to quickly fill the order gap caused by the impossibility of selling HiSilicon, a subsidiary of Huawei, due to US restrictions. This was announced today by TSMC Chairman Mark Liu.

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TSMC accelerates research and development related to 2 nm adoption

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The largest contract manufacturer of semiconductor products, Taiwan Semiconductor Manufacturing Co (TSMC), said that in the first half of next year it will begin trial production of products at 3 nm standards, and in the second half of 2022 this manufacturing process will be used in serial production. In addition, the company accelerated research and development related to the adoption of 2 nm standards. In particular, two installations necessary for this for EUV lithography were purchased.

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TSMC has problems implementing 3-nanometer process technology

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According to a source, TSMC has problems with the introduction of a 3-nanometer process technology: trial production of such substrates was supposed to begin in June, but is likely to be delayed until December. This was also affected by the high demand for 7- and 5-nanometer processors and single-chip systems and, obviously, the coronavirus pandemic.

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