It will be used in Redmi 9.
It was assumed that the company MediaTek in late December will present its second single-chip platform with a built-in 5G modem – and it all happened. The novelty is called Dimensity 800 and in the ranking table it occupies a position under the SoC Dimensity 1000 announced a month ago.
If the Dimensity 1000 is designed for flagship smartphones, then the lot of the Dimensity 800 is a mid-range model. Mass production of SoC will begin in the first quarter of next year, and real devices based on it will appear in the second quarter. There are already rumors on the Web that this single-chip system will be used in Redmi 9 (or Redmi 9 Pro).
The capabilities of the new SoC have not yet been fully disclosed, but the main parameters are already known. So, the CPU is represented by two clusters: large – with Cortex-A77 cores with a frequency of 2.6 GHz and small – with Cortex-A55 cores with a frequency of 2.2 GHz. GPU – Mali-G77 MP9. Exactly the same is used in the top-end SoC Samsung Exynos 990, but that one has a bit more cores. And, of course, the Dimensity 800 has a built-in 5G modem – Helio M70, which supports SA and NSA modes.
In fact, the Dimensity 800 should compete with the Qualcomm Snapdragon 765 / 765G, but there are no data on its performance in the benchmarks so that this can be assured for sure. But in terms of the number of SoCs with an integrated 5G modem, MediaTek is already bypassing Qualcomm with a score of 2: 1.