Asus ROG laptops use a liquid metal thermal interface

Asus Republic of Gamers (ROG) announced that it uses the Thermal Grizzly Conductonaut liquid metal thermal interface in new ROG gaming laptops equipped with 10th generation Intel Core processors, which can reduce the load on the cooling system and also significantly lower the temperature the processor.

The liquid metal layer between the processor and the heatsink perfectly removes heat from the chip. During laboratory tests, ROG experts recorded that the liquid metal thermal interface allows to reduce the operating temperature of various processor models by 10-20 ° C. This, in turn, allows the processor to operate at a higher frequency (which fans of overclocking will like), and the cooling system fan does not spin so fast, creating less noise. Such a laptop is faster and not so noisy.

The Conductonaut thermal interface uses a liquid metal alloy that was created by Thermal Grizzly. An automated two-stage thermal interface application process has also been developed. During the first stage, the silicone brush is dipped in a container with liquid metal and passes through the chip 17 times. Tests have shown that exactly as many passes are required to create the optimal layer of liquid metal. To prevent metal from spreading, a stainless steel gasket is used. During the second stage, the thermal interface is dotted on two more areas on top of the first layer.

The liquid metal thermal interface is used in ROG Strix and Zephyrus 2020 laptops.

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