AMD is actively working on the next generation of Ryzen processors. It will be based on the Zen 3 microarchitecture, which implies a transition to 8-core CCX modules, and a 7-nm process technology based on ultraviolet lithography will be used to release new products. According to the Chinese web resource MyDrivers, the release of new CPUs will take place closer to the end of next year.
Along with the new processors, the AMD 600 Series chipsets will debut. This line of chipsets will be the last for the Socket AM4 platform in its current form. To develop the flagship X670, the “red” chip maker plans to hire a contractor (probably ASMedia).
Like the current X570, it will support the PCI Express 4.0 interface, but at the same time provide more ports and expansion slots. It is expected that the AMD X670 will be deprived of many shortcomings of current logic, including high heat dissipation.
Recall that closer to 2022 Advanced Micro Devices intends to release processors with Zen 4 microarchitecture. They will become part of new platforms for the consumer and server markets and will support DDR5 RAM. According to the forecasts of the analytical company IDC, in 2021, DDR5 will occupy a quarter of the DRAM market, and after a year its share will grow to 44%.